PRODUCT

Multi-axis femtosecond laser micro-hole forming equipment
Equipped with high-quality industrial femtosecond laser with good beam quality and tiny power fluctuation, together with high-precision multi-axis control system, it can realise controlled taper fine machining of micro round holes, square holes, shaped holes, micro-cavities, cavities and other structures on all kinds of metal, non-metal, high-temperature alloys, composite materials and other materials.
Descriptions

Equipped with high-quality industrial femtosecond laser with good beam quality and tiny power fluctuation, together with high-precision multi-axis control system, it can realise controlled taper fine machining of micro round holes, square holes, shaped holes, micro-cavities, cavities and other structures on all kinds of metal, non-metal, high-temperature alloys, composite materials and other materials.


Applied in aerospace, biomedical, semiconductor, consumer electronics and other fields, it is suitable for high-precision micro-hole moulding processing of key parts of the industry, such as aero-engine turbine blade air film holes, automobile fuel injector nozzles, and medical filter mesh micro-holes.


Feature

High-precision multi-axis control system with high-precision multi-axis beam scanning module supports three-dimensional shaped micro-hole moulding processing on complex shapes;

High-precision laser rangefinder with self-developed algorithm to achieve the whole process of laser focus;

High-degree-of-freedom, high-speed beam scanning system, which can flexibly regulate the processing trajectory to achieve positive taper, no taper, inverted taper micro-hole forming processing;

High-precision laser power regulation system can control the removal amount of material by a single pulse, which can realise high-precision fixed depth straight blind hole processing.


Specification
    Technical parameters Models
    Laser Femtosecond laser
    Centre wavelength1030 nm/515 nm/343nm
    Output power stability < 0.5% RMS @ 24 hours
    Processing area 350 mmx350 mm (customised)
    RepeatabilityX : <±2 um ; Y : ≤±2 um ; Z : ≤±3 um ; A : ≤8" ;C:≤8'
    Minimum hole diameter<15um
    Depth to diameter ratio> 20:1
    Roundness>97%
    Power supply three-phase 380 V±10%;50 Hz
    Equipment power 15 kw
    Environmental requirements Ambient temperature:22±3°C;Relative humidity:55%10%


Showcase
  • Products
  • Femtosecond laser precision micro-hole drilling machine
  • Femtosecond Laser Carbonless Cutting Machine
  • Femtosecond laser submicron etching machine
  • Prescription
  • Precision Micro-hole Drilling Solutions
  • Carbonless cutting solutions
  • Sub-micron etching solutions
  • Contacts
  • Tel: 0755-23190051
  • Phone: 13928496221
  • E-mail: laser_zhanglei@szmono.cn
  • Add: 1F, Building 1, Chuangxiangdi, Yanxiang Zhigu, Guangming District, Shenzhen, China
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