PRODUCT

Femtosecond laser precision drilling machine for ceramic materials
Mainly for all kinds of extreme processing needs (no recast layer, no microcracks, no carbonisation) the development of special equipment, mainly used in curved surfaces, complex surface parts of ultra-fine cold machining, non-destructive precision cutting of thin metals, implantable, interventional all kinds of metal, non-metallic cutting, drilling, hard and brittle materials, microfluidic drilling, all kinds of conductive thin film cutting and so on.
Descriptions

Equipped with high-quality industrial femtosecond laser with good beam quality and tiny power fluctuation, together with the high-precision multi-axis control system, it can realise controlled taper fine machining of micro round holes, square holes, profiled holes, micro-cavities, cavities, and other structures on all kinds of metal, non-metal, high-temperature alloy, composite materials and other materials.


Applied in aerospace, biomedical, semiconductor, consumer electronics and other fields, it is suitable for high-precision micro-hole moulding processing of key parts of the industry, such as aero-engine turbine blade air film holes, automobile fuel injector nozzles, and medical filter mesh micro-holes.



Feature

High-precision multi-axis control system with high-precision multi-axis beam scanning module supports three-dimensional shaped micro-hole moulding processing on complex shapes;


High-precision laser rangefinder with self-developed algorithm to achieve the whole process of laser focus;


High-degree-of-freedom, high-speed beam scanning system, which can flexibly regulate the processing trajectory to achieve positive taper, no taper, inverted taper micro-hole forming processing;


High-precision laser power regulation system can control the removal amount of material by a single pulse, which can realise high-precision fixed depth straight blind hole processing.



Specification
    Technical parameters Models
    Laser   Femtosecond laser
    Centre wavelength1030 nm/515 nm/343nm
    Output power stability< 0 .5% RMS @ 24hours
    Processing area 350 mmx350 mm (customised)
    RepeatabilityX : <±2 um ; Y : ≤±2 um ; Z : ≤±3 um ; A : ≤8" ;C:≤8'
    Minimum hole diameter<15um
    Depth to diameter ratio> 20:1
    Roundness>97%
    Power supplyThree-phase 380 V±10%;50 Hz
    Equipment powe15 kw

    Environmental requirements

    Ambient temperature:22±3°C;Relative humidity:55%10%


Showcase
  • Products
  • Femtosecond laser precision micro-hole drilling machine
  • Femtosecond Laser Carbonless Cutting Machine
  • Femtosecond laser submicron etching machine
  • Prescription
  • Precision Micro-hole Drilling Solutions
  • Carbonless cutting solutions
  • Sub-micron etching solutions
  • Contacts
  • Tel: 0755-23190051
  • Phone: 13928496221
  • E-mail: laser_zhanglei@szmono.cn
  • Add: 1F, Building 1, Chuangxiangdi, Yanxiang Zhigu, Guangming District, Shenzhen, China
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