Specialised equipment has been developed for various processing needs (no recast layer, no microcracks, no carbonisation), implantable and interventional cutting of all types of metals and non-metals, biosensors, and cutting of various types of conductive films for detection.

Applied to aerospace, biomedical, semiconductor, consumer electronics and other fields, it is suitable for ultra-thin metal copper foil, aluminium foil, stainless steel foil, nickel alloy foil and other materials micro-fine precision non-destructive processing, as well as flexible PI, PET, glass, silicon substrate precision laser scribing, grooving, etching and other precision processing.

 Adopting femtosecond laser, ultra-short pulse processing with almost no heat conduction, ultra-fast laser and material action with very small impact force, very small thermal effect, ultra-fine and efficient cold processing mechanism, suitable for high-speed cutting of any organic & inorganic materials;

The cutting surface is neat, burr-free, no recast layer, no micro-cracks and metallurgical defects;

Higher single pulse energy, higher machining accuracy, fine machining of almost any solid material;

Non-selective and stress-free for materials.