Mainly for ultra-fine cold process etching of curved surfaces and complex shaped parts.

Used in aerospace, biomedical, semiconductor, consumer electronics and other fields. Suitable for ITO, FTO, zinc oxide, zirconium oxide, titanium oxide, nickel oxide NiOx, gold, silver, carbon powder and other conductive metals, oxide materials laser etching, high temperature alloys, metals, non-metals, especially composite materials surface microstructural machining, but also for the glass, silicon wafers, zirconium oxide ceramics, and other materials, ultra-fine line width laser etching, scribing, groove engraving.

Adopting femtosecond laser, ultra-short pulse processing with almost no heat conduction, suitable for high-speed drilling of any organic & inorganic materials, and can realise spatial angle microstructure processing of complex curved surfaces;

The hole wall is neat, burr-free, no recast layer, no micro-cracks and metallurgical defects;

Higher single pulse energy, higher machining accuracy, enabling fine machining of almost any solid material;

Non-selective and stress-free for materials.