Precautions in the operation process of automatic laser depaneling machine

Following the development of smart phones, wearable devices, VR devices, automotive sensors, smart home devices and other electronic devices miniaturisation, the demand for PCB high-density, high-performance is becoming more and more prominent, due to the comparison with the previous generation of microelectronic products, these miniaturised electronic devices are not only the physical standards, smaller, and more energy-efficient (longer battery life), lower prices.

Driven by this demand, PCB processing also tends to be widely used in thinner traditional circuit boards, its extensive use of flexible circuits, thicker conductive layers, and take full advantage of the low dielectric constant medium (especially in 5G technology). Cost considerations also reinforce the need to advance process utilisation. In detail, the spacing between boards is reduced to increase output.

Precautions in the operation process of fully active laser depaneling machines

Following the rapid growth in global demand for smart mobile devices, the need for fully active laser depaneling machines has increased dramatically. How to improve the production capacity and power is a great concern to us. Especially when dealing with irregular shapes of fan, semicircle, abnormality, polygon, rectangle,.... Manual break board improperly simple damage to the board, such as component cracking, solder joint damage, board deformation, uneven force, PCB brittle break, board appearance is not uniform.

At present, the enterprise has basically completed the mechanical separation of boards, rather than manual separation of boards. Of course, in order to complete the mechanical board, the need to use fully active laser depaneling machine. The principle of fully active laser depaneling machine is to use high-energy beam irradiation PCB appearance, through the control of beam energy density, frequency, speed, processing times and other parameters, to complete the vaporisation of PCB materials cut. Comparison with the manual break board, not only improve the production power, and greatly reduce the damage rate of the product.

Full-active laser depaneling machine operation process precautions

So, what is the operation process of the full-active laser depaneling machine preparation process? Look at the full-active laser depaneling machine operation process:

1. Check whether the equipment is normally energised, acknowledging that the equipment has been reset and is waiting for operation;

2. The operator to determine the direction of the pcb board and the positive and negative direction, the pcb board on the special fixture, with the palm of the hand quietly press, to admit that the pcb board has now been placed, put down the gland, to ensure that the pcb board is now covered tight;

3. Use the vision camera to adjust the programmed cut path and admit to save;

4. Press the start button, the fully active laser depaneling machine to start operation. Hoover, spindle electrostatic removal will also be active start, the milling cutter will be in accordance with the programmed cutting path for sub-panel;

5. complete the entire layout and sub-panel, actively exit the workbench, open the gland to ensure that the cut pcb board is not damaged, manually remove the product, replace the new pcb board, cover the gland, click the start button to execute the sub-panel action;

6. Repeat process 4.5 to cut all products.