Technical principle, characteristics and application areas of femtosecond laser perforation of probe cards

Probe card femtosecond laser perforation is an advanced laser processing technology that combines probe card technology and femtosecond laser technology for microfine hole processing on material surfaces. The following is an introduction to Probe Card Femtosecond Laser Punching:

Technical Principles

1. Probe card technology: Probe card technology is a technology used in laser processing to control the processing depth and shape. By controlling the position and shape of the probe card, precise processing control can be achieved.

2. Femtosecond laser technology: Femtosecond laser is a laser with extremely short pulses on the order of femtoseconds (1 femtosecond = 10^-15 seconds), which provides extremely high energy density and precise processing capability.

3. Punching process: During the probe card femtosecond laser punching process, the femtosecond laser is focused onto the surface of the material, generating a spot of high energy density. The probe card can control the size, shape and depth of the hole by controlling the laser irradiation position and time.

Features

1. High precision: Probe card femtosecond laser perforation has high precision processing capability, which can achieve micron or even nano-scale hole diameter and depth.

2. No thermal influence: the ultra-short pulse time of femtosecond laser makes there is almost no heat-affected zone during processing, avoiding thermal damage and deformation of materials.

3. No residue: Due to the processing method of femtosecond laser, there is almost no residue generated during the drilling process, which keeps the surface of the material clean.

4. Wide applicability: Probe card femtosecond laser perforation is suitable for a variety of materials, including metal, plastic, glass, etc., and can be used in microelectronics, biomedical, optical and other fields.

Application fields

1. microelectronics: used in the manufacture of micro-components, chips, circuit boards, etc. micro-fine hole processing.

2. Biomedical: Used in biomedical field for cell perforation, drug release and other applications.

3. Optics: Used in the manufacture of optical components, optical fibres and other micro-hole processing.

4. material processing: used in the field of material processing for the manufacture of microporous filters, microporous plates and other materials.

The development of probe card femtosecond laser perforation technology for microfine hole processing provides a highly efficient, solution, widely used in various fields, and promotes the progress of material processing technology.