Mainly for the ultra-fine cold machining of curved surfaces and complex-shaped parts, it can realise the micro-structure machining of high-temperature alloys, metals, non-metals, especially composite surfaces, such as through-holes, blind holes, profiled holes, micro-cavities, cavities, profiled grooves, and the equipment is suitable for all kinds of high-quality hole-making.
Applied to aerospace, biomedical, semiconductor, consumer electronics and other fields, suitable for aluminium foil, stainless steel foil, nickel alloy foil and other materials micro-fine precision non-destructive processing, implantable, interventional cutting of various types of metal, non-metal. As well as flexible PI, PET, glass, silicon substrate precision laser scribing, grooving, etching and other precision processing.
Applied in aerospace, biomedical, semiconductor, consumer electronics and other fields. Suitable for ITO, FTO, zinc oxide, zirconium oxide, titanium oxide, nickel oxide NiOx, gold, silver, carbon powder and other conductive metals, oxide materials laser etching, can achieve high temperature alloys, metals, non-metals, especially composite materials surface microstructural machining, but also for the ultra-fine linewidth laser etching, scribing, groove for glass, silicon, zirconia ceramics and other materials.
Relying on scientific research institutes to cross-fertilise materials, physics, chemistry and other disciplines to reach the forefront of laser technology research and application.
With rotary scanning, galvanometer scanning, trajectory processing three processing modes, can communicate with various types of lasers, motion control cards, automatic optimisation of the cutting process
High-precision vision positioning system + automatic loading and unloading inspection system to achieve automatic loading and unloading, automatic calibration, automatic precision machining, automatic inspection and so on.
About US
The company is headquartered in Guangming District, Shenzhen, with a subsidiary in Suzhou and related offices in North China and Northwest China. The company is committed to the research and application of femtosecond laser micromachining technology, including equipment development, production, sales and OEM business. The company's products are widely used in biomedical, aerospace, semiconductor advanced packaging, consumer electronics, research institutes and many other industries. The company's main products: femtosecond laser multi-axis precision hole-making equipment, femtosecond laser multi-axis precision etching/cutting equipment, semiconductor advanced packaging laser printing equipment, laser precision depaneling equipment, laser precision soldering equipment.